Brewer Science was featured in a technical presentation at the 11th IEEE Electronics System-Integration Technology Conference (ESTC 2026), taking place September 9–11, 2026, in Helsinki, Finland.
“A Fan-Out RDL-first Process Flow Using Temporary Glass Carriers”
Presented Thursday, September 10, at 9:50 AM, in Session AP 3: Heterogeneous Integration 1, by Yilun Luo, Applications Engineer at Brewer Science and co-presented with imec.
The paper details an RDL-first process flow evaluated on glass carriers for advanced packaging applications, including:
• A semi-additive RDL process achieving 3 µm line/space resolution on organic UV laser release layers
• Evaluation of warpage behavior after overmolding to 200 µm and grinding back to 100 µm, with no delamination observed from the temporary carrier system
• Identification of a temporary bonding material with sufficient adhesion to the epoxy mold compound as the key enabler of successful RDL transfer
• Selected a release layer and a bonding material supporting a functional glass-carrier RDL-first flow
This work reflects Brewer Science’s continued role in advancing materials for next-generation fan-out wafer- and panel-level packaging (FOWLP/PLP), supporting the industry’s push toward higher routing density and large-area processing.
Event Information: https://www.conftool.org/estc2026/index.php?page=browseSessions&form_date=2026-09-09&form_session=28&presentations=show#paperID160
For information about the presentation topic, submit a request at the bottom of our Brewer Science website.