Rolla, Mo. – September 24, 2026 – Brewer Science, a global leader in advanced materials for the semiconductor and microelectronics industries, will take part in two sessions at the 59th International Symposium on Microelectronics (IMAPS 2026), taking place September 28 – October 1, 2026, at the Encore Boston Harbor in Boston, Massachusetts. Brewer Science researchers and executives will share new data on high-temperature-stable temporary bonding/debonding (TBDB) materials and join an industry panel addressing supply chain pressures created by AI-driven semiconductor growth.
TECHNICAL PRESENTATION
High-Temperature Resistant Laser-Release Material for Advanced Packaging Temporary Bonding/Debonding Applications
As advanced packaging moves toward high-density 3D architectures, process steps such as plasma-enhanced chemical vapor deposition, hybrid bonding, silver sintering, and thermal compression bonding increasingly demand temperatures between 250°C and 350°C — conditions that strain the thermal stability, adhesion, and cleanability of conventional TBDB materials. In this presentation, Brewer Science will detail a laser-release material engineered specifically for these high-temperature environments. The material demonstrates strong adhesion across silicon, glass, and epoxy-compound substrates, a tunable coating thickness that accommodates varied device topographies, and mechanical flexibility that minimizes wafer bow and warpage. Paired with BrewerBOND® C1301-series adhesive in a complete TBDB system, the material maintains structural integrity through processing temperatures up to 350°C, offers debond performance at both 308-nm and 355-nm UV-laser wavelengths, and enables straightforward solvent-based cleaning after high-temperature processing. The presentation will cover the material’s design principles, thermal and mechanical characterization, debonding and cleaning performance, and results from application-level testing that simulates high-temperature manufacturing environments.
Presenter: Xin Li, Manager I, R&D, Brewer Science, Inc.
Co-Authors: Arthur Southard, Brandon Neil, Dongshun Bai, Brewer Science, Inc.
Session Details
Date: Wednesday, September 30, 2026
Time: 3:30 – 4:25 PM
Session: W-PM1 – Materials and Processes for Large Form Factor Package Assembly
Location: Cezanne 1-2
PANEL DISCUSSION
Supply Chain Shortages Driven by Growth in the AI Era
Dan Sullivan, Ph.D., Chief Product Development Officer at Brewer Science, will join a panel of industry leaders examining how surging AI-driven demand is reshaping semiconductor supply chains — including where shortages are emerging, how material and equipment suppliers are responding, and what it will take to keep pace with the industry’s growth trajectory.
Panelist: Dan Sullivan, Ph.D., Chief Product Development Officer, Brewer Science, Inc.
Session Details
Date: Wednesday, September 30, 2026
Time: 4:30 – 5:30 PM
Location: Picasso 2-3 Ballroom
For more information, visit imaps.org or www.brewerscience.com
About Brewer Science
Brewer Science is a global leader in developing and manufacturing next-generation materials and processes that foster the technology needed for tomorrow. Since 1981, we’ve expanded our technology portfolio within advanced lithography, advanced packaging, smart devices, and printed electronics to enable cutting-edge microdevices and unique quality monitoring systems for water and air applications. We are Certified Employee-Owned and a Certified B Corporation™, using our business as a force for good. Our headquarters are in Rolla, Missouri, with customer support throughout the world. Learn more at: www.brewerscience.com.
Media Contact:
Nathan Ayres
Email: nayres@brewerscience.com