October 8-11, 2018
Pasadena, CA
October 8-11, 2018
Pasadena Convention Center
Pasadena, CA
Brewer Science will attend the 51st International Symposium on Microelectronics, organized by the International Microelectronics Assembly and Packaging Society (IMAPS). This year IMAPS has rolled out a new technical program that has been organized to help attendees find their key interests faster by defining 5 leading Tracks with topics centered around major package platforms such as Wafer Level, Flip Chip, 2D/3D and SiP. Brewer Science is proud to offer a variety of products to optimize your processes – check out our product offerings and learn more about our systems here.
Brewer Science will have the following speaking sessions:
- Title: Advances in Temporary Bonding and Debonding Technologies for Use with Wafer-Level System-in-Package (WLSiP) and Fan-Out Wafer-Level Packaging (FOWLP) Processes
- Date: Tuesday, October 9, 2018
- Time: 4:30 PM
- Speaker: Shelly Fowler
Don’t forget to mark your calendars for your favorite sessions here and learn more about the upcoming conference by visiting the IMAPS website. Follow us on Twitter, Facebook and LinkedIn to see the latest conference updates, industry insights, articles and blogs throughout the year.