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December 13-15, 2016 San Francisco, CA Brewer Science will be presenting at the 13th Annual 3D Architectures for Semiconductor Integration and Packaging in San Francisco, California. Presentation: Temporary Wafer Bonding Technology for Advanced Packaging Session: Equipment and Materials 4:40PM - 5:00PM | Wednesday, December 14th, 2016 Dongshun Bai, Brewer Science Emerging Brewer Science Technologies at 3D…
Click Here to Read MoreNovember 16-17, 2016 Santa Clara, California Booth: T19 Presentation: Carbon Nanomaterials: Defining the Future of High-Speed Printed Sensors Time: November 16th, 2016 | 13:55 - 14:15 By: Nick Anthony and Rob Frueh This is the world’s largest event for printed and flexible electronics. This event, featuring more than 225 exhibitors from around the globe, is attended by…
Click Here to Read MoreOctober 30- November 2nd, 2016 Orlando, Florida http://ieee-sensors2016.org/ Come check out our InflectTM sensors demos at booth 12
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