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Ultrafast, Highly Sensitive Printed Moisture Sensors for High-Speed Sensing Applications At the 2017 Sensors Expo & Conference that took place in San Jose, California last June, Dr. Vijaya Kayastha presented on an ultra-fast, highly sensitive printed moisture sensor developed at Brewer Science. Dr. Kayastha discussed the potential applications of these sensors that are not currently…
July 19, 2017 Ebook Read MoreUltrafast, Highly Sensitive Printed Moisture Sensors for High-Speed Sensing Applications At the 2017 Sensors Expo & Conference that took place in San Jose, California last June, Dr. Vijaya Kayastha presented…
Read MoreFrom its founding, Brewer Science has put a premium on creativity and innovation. These are the driving forces that have allowed it to obtain numerous patents and create products that…
Read MoreIs your company planting seeds for future growth? Brewer Science continues to promote more skilled scientists and engineers in the American workplace through STEM. Having long recognized the need for…
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We are excited to be a part of and see the next phase of @JVIC_MSU at @MissouriState #expansion twitter.com/CRileyNL/statu…
Big news today: @MissouriState reaches agreement with @VecinoGroup to expand @JVIC_MSU complex in downtown Springfield #IDEACommons @A_D_Kunkel @ClifSmart @RMDockery https://t.co/f7m29yADiG via @springfieldNL
— Claudette Riley (@CRileyNL) December 12, 2019
In 2015, Brewer Science opened a manufacturing facility in Vichy, MO. This facility features a closed-loop #geothermal HVAC design that provides a portion of heating & cooling to the building. Read about geothermal power here: (hubs.ly/H0lYdg-0) #sustainablemanufacturing
Thanksgiving is a time to remember everything we’re #thankful for. Brewer Science is grateful for our customers & partners, our community, & most importantly, our amazing employees. We wouldn’t be here today without them. We’d like to wish a very happy Thanksgiving to all!
Brewer Science will attend & present at the 2019 Electronics Packaging Technology Conference (EPTC) in Singapore. If you want to meet with our experts during the conference, let us know: (hubs.ly/H0lYdhN0) #HeterogenousIntegration #WaferLevelPackaging
Kim Yess, Brewer Science’s Technology Director of Wafer-Level Packaging Material, weighed in on the challenges of panel-level fan-out packaging with @SemiEngineering. Check out the full article here: (hubs.ly/H0lYj-50) #advancedpackaging