VIDEO: Advanced Packaging – The Road to the Future
September 07, 2017Video
Learning more about our debonding technologies.
How Temporary Bonding Works
May 31, 2017Video
How Temporary Bonding Works Learn how temporary bonding and ultra-thin wafers are being used to create smaller and faster electronic devices. Check out our temporary bonding materials here
Inflect™ Moisture Sensor
April 06, 2017Video
InFlect™ moisture sensors utilize our revolutionary carbon-based nanotechnology to deliver highly sensitive and real time response to small changes in moisture and are ideal for monitoring low-humidity environments.
[VIDEO] Directed Self-Assembly at Brewer Science
March 21, 2017Video
Directed self-assembly (DSA) is an exciting new technology that uses specially designed block copolymers to form IC patterns on a molecular scale.
Understanding Panel-Level Processing
March 07, 2017Video
Understanding Panel-Level Processing Ram Trichur explains how the transition from conventional wafers to large panels can generate significant cost savings for fan-out wafer-level packaging, and how these large, thin panels pose new challenges for handling and processing. Learn more about our Wafer-Level Packaging developments here.
Brewer Science Inflect™ Flex Sensor
March 03, 2017Video
Brewer Science Inflect™ Flex Sensor InFlect™ flex sensors utilize our revolutionary carbon-based nanotechnology to deliver a highly sensitive and real-time response to varying angles of deflection.
Advanced Lithography: What is Multilayer Technology?
February 06, 2017Video
Multilayer technology from Brewer Science has allowed the industry to continue to push the limits of advanced lithography well into the future. Our experts explain why it was needed and how it eventually became the industry standard for leading-edge semiconductor manufacturing.
ProTEK® Materials
February 02, 2017Video
ProTEK® Materials Highly oleophobic and hydrophobic transparent scratch-resistant coating.
Why do we need temporary bonding technology?
February 01, 2017Video
Why do we need temporary bonding technology? Ram Trichur is back to discuss how temporary wafer bonding technology allows IC manufacturers to safely handle ultra-thin wafers during advanced processing and packaging steps. Thinning the wafers before the chips are packaged allows for thinner electronic devices and overall better performance Check out our temporary bonding materials…
Fan-Out Wafer-Level Packaging
January 30, 2017Video
What is "Fan-out Wafer-Level Packaging"? Fan-out wafer-level packaging (FOWLP) has been described as a game changer by industry experts because of its thin form factor, low cost of ownership, and ease of integration using conventional wafer fab equipment. In this video, Ram Trichur describes a typical FOWLP process flow and the challenge of handling the…
