Brewer Science unveils innovative advanced packaging solutions at SEMICON Taiwan and Advanced Packaging Summit 2023 Innovative bonding materials presented at leading Asia technology conferences Tapei, Taiwan – August 28, 2023 – Brewer Science, Inc., will present new developments in temporary and permanent bonding material technologies for advanced packaging this week at Asia’s two premier technology…

Vichy, Missouri - August 15, 2023 - Brewer Science, a global leader in developing and manufacturing next-generation materials and products for the semiconductor industry, is thrilled to announce the expansion of its Vichy Manufacturing Center with a ribbon-cutting ceremony. This momentous occasion marks a significant step forward in supporting the exponential growth projected for the…

Brewer Science Presents Printed and Flexible CO2 Sensors at Carbon 2023 Conference     Cost-efficient and robust screen-printed sensors are the future of CO2 sensing   Cancun, Mexico– July 13, 2023 –Brewer Science, Inc., a global leader in developing and manufacturing next-generation materials and processes for the microelectronics and optoelectronics industries, will present Printed and Flexible CO2…

Brewer Science is one of only 22 Distinguished Award recipients across Intel’s global supply chain   Rolla, MO, June 22, 2023 – Brewer Science is proud to announce that it has earned Intel’s EPIC Distinguished Supplier Award. Through its dedication to Excellence, Partnership, Inclusion, and Continuous (EPIC) quality improvement, Brewer Science has achieved a level…

Brewer Science’s High-Temperature-Stable, Gapfilling Planarizing Material Revolutionizes Advanced ArF and EUV Processes OptiStack® SOC450 material provides zero shrinkage up to 550°C when baking in N2 June 15, 2023 – Rolla, MO - Brewer Science, Inc., a global leader in developing and manufacturing next-generation materials for the microelectronics and optoelectronics industries, is thrilled to announce the…

Imec and Brewer Science present process solutions for CVD oxide deposition processes on ultrathin wafers at Electronic Components and Technology Conference (ECTC) Process challenges during CVD oxide deposition on the backside of 20-µm thin 300-mm wafers temporarily bonded to glass carriers Grande Lakes, FL – May 22, 2023 – Brewer Science, Inc., a global leader…

Co-presenting “Photonic Debonding for Wafer–Level Packaging” at CS MANTECH, held May 15-18 in Orlando, FL. Orlando, Florida – April 25, 2023 – Brewer Science, Inc. and PulseForge, Inc. bring substantial cost savings, increased throughput, and other benefits with photonic debonding to semiconductor advanced packaging. This collaboration combines a global leader in manufacturing next-generation materials and…

New developments in underlayers play key role in advanced EUV lithography Rolla, Mo.– April 11, 2023 – Brewer Science, Inc., a global leader in developing and manufacturing next-generation materials for the microelectronics and optoelectronics industries, will present New Developments in Underlayers and Their Role in Advancing EUV Lithography at Critical Materials Council (CMC) Conference. Demand…

Brewer Science Earns GreenCircle Certification for Zero Waste to Landfill for Eighth Consecutive Year Brewer Science is the first company in the semiconductor industry with GreenCircle Certification Rolla, Mo.– March 2023–Brewer Science, a global technology leader, is pleased to announce it has earned Zero Waste to Landfill Certification for the eighth consecutive year. The Zero…

Real-time measurement of lead, nitrate and pH using printed sensors presented at LOPEC   Munich, Germany – February 21, 2023 – Brewer Science, Inc., a global leader in developing and manufacturing next-generation materials and processes for the microelectronics and optoelectronics industries, will be presenting its newest water quality monitoring innovations, and exhibiting at booth 414…