2020 IEEE 70th  Electronic Components and Technology Conference

July 2020

Brewer Science participated in the 2020 IEEE 70th  Electronic Components and Technology Conference (ECTC).

Xiao Liu, Senior Program Manager at Brewer Science, presented ‘Introduction of a New Carrier System for Collective Die-To-Wafer Hybrid Bonding and Laser-Assisted Die Transfer’ in Session 7: Advances in Packaging at Wafer/Panel Level

 

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