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NextFlex Workshop 2025: Presenting "Building Circuits from the Ground Up: Materials Innovation for Additive Electronics"

Brewer Science will present at NextFlex Workshop: Hybrid Electronics for Automotive and Aerospace Applications on October 15 – 16, 2025 in Huntsville, Alabama. Dr. Adam Scotch will present Building Circuits from the Ground Up: Materials Innovation for Additive Electronics on October 16 at 8:30am CST, during Session 4: Industrial Capabilities & Needs for Next Gen…

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Brewer Science Expands U.S. Operations with New Chandler, Arizona Office and Lab

Brewer Science Expands U.S. Operations with New Chandler, Arizona Office and Lab Collaboration with semiconductor customers and research partners, access to talent among key considerations     CHANDLER, Arizona. – September 23, 2025 – Brewer Science, Inc., a global leader in developing and manufacturing next-generation materials and processes for the microelectronics and optoelectronics industries, announces…

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EPTC 2025

Brewer Science will be co-presenting at 27th Electronics Packaging Technology Conference (EPTC), December 2nd through December 5th at Resorts World in Sentosa, Singapore. Brewer Science is a Bronze Sponsor of EPTC. Learn more

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Participating in the Next-Generation Semiconductor Packaging Consortium "JOINT3"

Participating in the Next-Generation Semiconductor Packaging Consortium "JOINT3" Brewer Science has joined the next-generation semiconductor packaging consortium "JOINT3." September 3, 2025 - JOINT3 is a co-creation evaluation platform established by Resonac Corporation (President and CEO: Hidehito Takahashi, hereinafter “Resonac”) with the aim of accelerating the development of materials, equipment, and design tools optimized for panel-level…

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Brewer Science Presents Materials’ Impact in Sustainable Processes, AI, and High-Performance Computing

Brewer Science Presents Materials’ Impact in Sustainable Processes, AI, and High-Performance Computing Presentations at SEMICON Taiwan 2025 demonstrate how materials impact sustainability, artificial intelligence, and high-performance computing   Taipei, Taiwan – August 27, 2025 – Brewer Science, Inc., a global leader in developing and manufacturing innovative materials for micro- and optoelectronics, will share its expertise…

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Brewer Science Supports the Restoration of Full R&D Tax Deductibility with the Passage of OBBB

Brewer Science Supports the Restoration of Full R&D Tax Deductibility with the Passage of OBBB Legislation Strengthens U.S. Semiconductor Manufacturing and Innovation   Rolla, MO., August 12, 2025—Brewer Science, a global leader in developing and manufacturing next-generation materials and products for the semiconductor industry, celebrates the restoration of 100% tax deductibility for research and development…

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Brewer Science Named 2025 National Top Workplace in Manufacturing Industry

Brewer Science Named 2025 National Top Workplace in Manufacturing Industry  Ninth Consecutive Year Receiving 2025 Top Workplace in Greater St. Louis   Rolla, MO – August 7, 2025 – Brewer Science, Inc., a global leader in developing and manufacturing next-generation materials and processes for the microelectronics and optoelectronics industries, has been named a 2025 National…

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Brewer Science Supports Social Emotional Literacy by Collaborating with Local Author

Brewer Science Supports Social Emotional Literacy by Collaborating with Local Author The Alphabet Feelings Series provides teachers with a unique approach to education   The core of Brewer Science’s brand philosophy is that innovation begins with imagination, and imagination starts with opening your mind to new ideas, no matter your age, background, or skillset. Recognizing…

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Brewer Science Presents Materials Innovation for Additive Electronics at TechBlick 2025

Brewer Science Presents Materials Innovation for Additive Electronics at TechBlick 2025 Building Circuits from the Ground Up: Domestic Advanced Packaging Relies on Additive Manufacturing   Boston, Massachusetts – June 4, 2025 – Brewer Science, Inc., a global leader in advancing innovative materials needed for additive electronics, is presenting “Building Circuits from the Ground Up: Materials…

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Brewer Science to Showcase Advanced Material Innovations at CS MANTECH and ECTC 2025

Brewer Science to Showcase Advanced Material Innovations at CS MANTECH and ECTC 2025 Enabling 3D integration requires strategic temporary bonding material selection   Rolla, Mo. – May 14, 2025 – Brewer Science, Inc., a global leader in advanced packaging materials for the semiconductor industry, will present innovations in temporary bonding materials at two premier conferences this…

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