May 31st - June 3rd, 2016
Las Vegas, Nevada
Presentation
Friday, June 3rd · 2:20PM
Session 36: 3D materials & Processing
Extremely Low-Force Debonding of Thinned CMOS Substrate by Laser Release of a Temporary Bonding Material”
Alain Phommahaxay, Goedele Potoms, Greet Verbinnen, Erik Sleeckx, Gerald Beyer, and Eric Beyne – IMEC; Alice Guerrero, Dongshun Bai, Xiao Liu, Kim Yess, and Kim Arnold – Brewer Science Inc.; Walter Spiess, Tim Griesbach, Thomas Rapps, and Stefan Lutter – SÜSS MicroTec Lithography GmbH
Program Session – Co-Chair
Materials & Processing
Room: Mont-Royal 1
Thursday, June 2nd · 8:00AM – 11:40AM
Kwang-Lung Lin – National Cheng Kung University
Kimberly Yess – Brewer Science
http://www.ectc.net/