Brewer Science presents EUV lithography innovation at Fujifilm Advanced Lithography Workshop in Germany

15 September 2022
Dresden, Germany

Brewer Science presents EUV lithography innovation at Fujifilm Advanced Lithography Workshop in Germany

Brewer Science will be presenting at the Fujifilm Advanced Lithography Workshop in Desden, Germany on 15 September 2022. Dr. Douglas Guerrero will deliver a presentation titled, Roles of Underlayers in Resist and Underlayer Roadmap for EUV Lithography, during Session II of the conference at 14:20 central European time. Brewer Science is also a proud sponsor of this event.

Semiconductor Innovation Requires Materials for Extreme Ultraviolet Lithography (EUV)

EUV lithography is used to pattern the smallest features in advanced semiconductor devices. The demand for smaller devices with more capabilities requires industry innovation in EUV processes and materials. Additionally, EUV plays a critical role in the evolution of technology and enables the continuous advancement of the semiconductor roadmap, as it provides the capabilities of higher processing power, while using less energy, and providing higher performance. However, one of the biggest challenges facing EUV lithography is material requirements, recognizing the critical role underlayers play in the patterning of EUV lithography. Unlike bottom anti-reflective coatings (BARC), thickness is not limited by wavelength, but rather related to resist and process requirements.

Roles of Underlayers in Novel Patterning for EUV Lithography

Dr. Douglas Guerrero, Senior Technologist at Brewer Science, has published over 60 papers in the areas of conducting polymers, BARCs, DSA, and underlayers for EUV lithography, and is an inventor on over 20 US patents. In his presentation, Resist and Underlayer Roadmap for EUV Lithography, during Session II at the Fujifilm Advanced Lithography Workshop, he will provide information on the device and materials roadmap, as well as answer questions to the most critical questions in the industry:

  • How does overall EUV patterning require thinner layers?
  • What challenges do chemically amplified resists (CARs) and underlayers face?
  •  What role will underlayer play in future patterning?
  • What are the options for patterning without a CAR?

If you are unable to attend, but wish to learn more about Brewer Science’s innovative EUV lithography materials, you can visit our website to view datasheets and schedule a call with an EUV expert.

To learn more about the Fujifilm Advanced Lithography Workshop, please visit their page.

  EUV
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