Brewer Science to Showcase Advanced Material Innovations at CS MANTECH and ECTC 2025
Enabling 3D integration requires strategic temporary bonding material selection
Rolla, Mo. – May 14, 2025 – Brewer Science, Inc., a global leader in advanced packaging materials for the semiconductor industry, will present innovations in temporary bonding materials at two premier conferences this May: CS MANTECH 2025 and the 75th Electronic Components and Technology Conference (ECTC).
CS MANTECH 2025
May 19 – 22, 2025 | New Orleans, Louisiana | Booth #600
At CS MANTECH, Brewer Science will highlight its latest advancements in temporary bonding materials.
Joe Raposo, Sales Team Member at Brewer Science, will deliver a presentation during the Exhibitor Forum discussing material development trends and solutions that support next-generation devices, including BrewerBOND® materials designed to enable high-yield wafer thinning processes for advanced compound semiconductors such as GaAs, GaN, InP, and SiC.
Visit Booth #600 at CS MANTECH to learn about Brewer Science’s latest developments in temporary bonding materials enabling compound semiconductor performance at scale.
ECTC 2025
May 27 – 30, 2025 | Dallas , Texas | Booth #439
At ECTC, hosted by IEEE, Brewer Science will co-present two technical papers in collaboration with leading global research institutions:
Hierarchical Multi-Layer and Stacking Vias with Novel Structure by Transferable Cu/Polymer Hybrid Bonding for High-Speed Digital Applications –
Co-presented with ITRI, this paper will be delivered on Wednesday, May 28th at 4:25 PM in Room Texas C, as part of the Interconnections session.
Characterization of FOWLP Process Using Temporary Bonding Materials on Carrier With Very Low Die Shift – Co-presented with imec, this study will be featured during the Interactive Presentations on Thursday, May 29th at 2:30 PM in Longhorn D, offering insights into achieving precision alignment in advanced fan-out wafer-level packaging.
Visit booth #439 at ECTC to learn about Brewer Science’s leadership in delivering temporary bonding materials that enable 3D integration and advanced packaging performance at scale.
For more information, visit www.brewerscience.com or connect with us at the conference.
About Brewer Science
Brewer Science is a global leader in developing and manufacturing next-generation materials and processes that foster the technology needed for tomorrow. Since 1981, we’ve expanded our technology portfolio within advanced lithography, advanced packaging, smart devices, and printed electronics to enable cutting-edge microdevices and unique quality monitoring systems for water and air applications. We are Certified Employee-Owned and a Certified B Corporation™, using our business as a force for good. Our headquarters are in Rolla, Missouri, with customer support throughout the world. Learn more at: www.brewerscience.com.
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Company Contact:
Nathan Ayres
Tel: (US) +1.573.364.0444, ext. 1923
Email: nayres@brewerscience.com