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Fabrication of microelectronic devices increasingly involves the creation of high-aspect-ratio structures (those with large height or depth and narrow width, such as trenches, vias, columns, and mesas). These structures provide…
October 15, 2016 Blogs Read MoreHigh-k metal gate (HKMG) technology has become one of the front-runners for the next generation of CMOS devices. This new technology incorporates a high-k dielectric, which reduces leakage and improves…
Read MoreA variety of factors can affect the coat quality when spin processing. This article will focus on the role that the bowl environment, and in particlar the ability to control…
Read MoreCost of ownership plays an important role in lithography process materials and methods decisions. Process simplifications brought about by layer-to-layer synergy drive significant cost of ownership advantages for multilayer lithography…
Read MoreLimitations of Moore's Law Ultimately, performance of computers and other electronic products will be limited by transistor size and density. Because the semiconductor industry has pushed to create ever-smaller features…
Read MoreHigh-uniformity bake plates have been displacing convection ovens for well over two decades in the microelectronics industry. The disadvantages of variable temperature zones, lengthened cure times, and considerable particle contamination…
Read MoreOver the past decade, Brewer Science has developed and published various methods of creating a planar surface over three-dimensional (3-D) structures. Sharing these results invariably leads to a potential customer…
Read MoreAt the Science Café event held at Farmers Gastropub on April 19, James E. (Jim) Lamb III, Brewer Science Corporate Technology Strategist and Director of the Printed Electronics Technology Center,…
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June 8th - 8am till noon • Brewer Science, Inc. Parking Lot 2401 Brewer Drive, Rolla (located in Hypoint Industrial Park at 1-44 Exit 189 /Highway V) [+]
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