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Methods of transferring device wafers or layers between carrier substrates and other surfaces
Click Here to Read MoreHigh-temperature, spin-on, bonding compositions for temporary wafer bonding using sliding approach
Click Here to Read MoreAll-organic inductor-capacitor tank circuit for radio frequency sensor applications
Click Here to Read MoreSpin-on spacer materials for double- and triple-patterning lithography
Click Here to Read MoreDual-layer light-sensitive developer soluble bottom anti-reflective coatings for 193-nm lithography
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