BrewerBOND® 220

Temporary Bonding Materials

BrewerBOND® 220 temporary wafer bonding material is an organic coating that enables back-end-of-line (BEOL) processing of ultrathin wafers using standard semiconductor equipment. This product improves throughput, simplifies cleaning, and shortens processing time.

Mechanical Release Illustration

Key Market Sectors

  • 3-D wafer-level packaging
  • MEMS
  • Compound semiconductor

BrewerBOND® 220 Material vs. Wax

 WaxBrewerBOND® Material
Thickness Range~ 10 – 35 µm
20 µm – 150 µm
Coating Throughput
Requires multiple coatsSingle-coat process
Bonding Material Induced Stress
< 1 µm
< 5 µm (8” substrate)
Bonding Temperature Range
95ºC - 110ºC130ºC – 170ºC
Debonding Temperature Range
95ºC - 110ºC
150ºC – 240ºC
Thermal Stability Temperature Range
< 120ºC≤ 250ºC

Learn how BrewerBOND® 220 Materials are replacing wax

For coatings thicker than 20 µm, BrewerBOND® 220 material is a good option as an alternative solution to typical wax adhesives. It offers significant advantages because it can be applied with a one-coat process. The material provides up to a 160-μm film with a single coat and customized spin process. BrewerBOND® 220 material enables backside temperature processing up to 250°C with minimal device wafer bowing. BrewerBOND® 220 material does not introduce additional stress in the bonded stack. This versatile material can be used for the thermal slide or mechanical debonding methods.


  • Enables backside temperature processing at 200°C – 240°C
  • Enables slide debonding with low force
  • Enables minimal device wafer bowing during processes
  • Up to 160-μm film possible with a single coat and customized spin process BrewerBOND® 220 Bonding Material Coating Parameters (8” substrate) Static dispense in center of wafer