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Thermal slide debonding represents the next significant advancement in obtaining high-yield thin wafer results. Initial detection of anomalies and cracks usually occurs during debonding; however, many causes for this damage originate during upstream bonding material coating, curing, bonding, and thinning processes. Moreover, only thermal separation tools that are highly precise and highly accurate will consistently…
Click Here to Read MoreThin-wafer processing trends Several spin-coating process applications require the ability to uniformly coat, develop, and/or rinse (clean) thinned and fragile substrates. Safely handling these fragile materials is paramount and requires specially designed spin chucks and thin-wafer handling techniques. The substrates are made of a wide array of materials, and some of the more popular ones…
Click Here to Read MoreLimitations of Moore's Law Ultimately, performance of computers and other electronic products will be limited by transistor size and density. Because the semiconductor industry has pushed to create ever-smaller features with photolithography, engineers have been able to shrink transistors far beyond original expectations to dramatically increase the density of transistors on a chip, thereby enabling…
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