300-mm Ultrathin Wafer Handling: Presentation Highlights High-Temperature-Stable Temporary Bonding and IR Laser Debonding with Si Carriers

300-mm Ultrathin Wafer Handling: Presentation Highlights High-Temperature-Stable Temporary Bonding and IR Laser Debonding with Si Carriers

 

Chemnitz, Germany. – December 2, 2025 – Brewer Science, in collaboration with EV Group (EVG) and Fraunhofer IZM ASSID, will co-present groundbreaking research on ultrathin wafer handling at WaferBond ’25 conference in Chemnitz, Germany. Fraunhofer ASSID will lead the presentation, demonstrating a process flow for handling 300-mm wafers thinned to 15 µm with the use of silicon carriers, BrewerBOND® high-temperature-stable adhesive, and EVG® IR laser debonding technology, addressing key challenges in mechanical stability, high-temperature compatibility, and stress-free wafer separation.

 

Presentation Title:
300-mm Ultrathin Wafer Handling with High-Temperature-Stable Temporary Wafer Bond Adhesive (Enabling IR Debonding Technology) with Si Carriers

 

Presenters:
Andreas Gang, Aron Riffert (Fraunhofer IZM ASSID)
Matthew Koch (Brewer Science)
Urban Peter, Julian Bravin, Cornelia Reitinger, Mathias Pichler, Elisabeth Brandl (EV Group)

 

Session Details:

      • Date: Thursday, December 4
      • Time: 9:10 AM
      • Location: Room Küchwald II
      • Session: 3D Integration 1

 

Brewer Science is proud to be a Silver Sponsor of this event, reinforcing its commitment to advancing semiconductor technology.

 

 

What will you learn?
This presentation answers three critical questions for manufacturers and engineers:

        1. How can you maintain mechanical stability when thinning wafers to 15 µm for advanced packaging?
        2. What adhesive technology ensures compatibility with high temperatures up to 450°C?
        3. How does IR laser-based debonding with Si carriers reduce stress and improve wafer quality compared to traditional methods?

 

Join us to explore how this integrated approach, combining BrewerBOND® C1301-10 adhesive with EVG® 880 LayerRelease™ technology, enables reliable ultrathin wafer processing for next-generation semiconductor applications.

 

For more information, visit https://www.waferbond.de/ or www.brewerscience.com.

 

 

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About Brewer Science

Brewer Science is a global leader in developing and manufacturing next-generation materials and processes that foster the technology needed for tomorrow. Since 1981, we’ve expanded our technology portfolio within advanced lithography, advanced packaging, smart devices, and printed electronics to enable cutting-edge microdevices and unique quality monitoring systems for water and air applications. We are Certified Employee-Owned and a Certified B Corporation™, using our business as a force for good. Our headquarters are in Rolla, Missouri, with customer support throughout the world. Learn more at: www.brewerscience.com.

 

 

 

Media Contact:

Nathan Ayres

Email: nayres@brewerscience.com

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