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February 13, 2017 – Tokyo, Japan – Brewer Science invites you to join them February 15 through February 17 at Printable Electronics Japan 2017, a part of the Converting Technology Exhibition, as the company showcases original sensor technology products created and manufactured at Brewer Science. This exhibition is focused on accelerating innovation and solutions found…
Click Here to Read MoreJanuary 19, 2017 – Belle, MO – Brewer Science is investing in the innovators of tomorrow by promoting opportunities for learning more about science, technology, engineering, and math (STEM) in the elementary schools located in Vienna and Belle, MO. Teaming up with several local teachers, Brewer Science’s intern program recently hosted a Steak Dinner and…
Click Here to Read MoreNew Report by President’s Council of Advisors on Science and Technology Reinforces Need for Greater Competition with China January 17, 2017 – Rolla, MO - Brewer Science is supporting the findings in a new report outlining long-term solutions for continued U.S. leadership in the global semiconductor industry. Brewer Science, a national and global leader in…
Click Here to Read MoreJanuary 8-11, 2017 Half Moon Bay, California Brewer Science is proud to sponsor two sessions at the 2017 SEMI ISS. The first is the keynote session entitled ‘Data Center: Innovation, Opportunity and Growth’ on Tuesday, January 10th beginning at 8:00 AM and the second is Session 3 on 'Technology' which will immediately follow the keynote…
Click Here to Read MoreDecember 14-16, 2016 Tokyo, Japan Booth: 3408 SEMICON Japan is the premier exposition for microelectronics manufacturing supply chain. Brewer Science products will be on display at our booth. Emerging Brewer Science Technologies at SEMICON Japan Wafer-Level Packaging Directed-Self Assembly Multilayer Systems Conference Website: http://www.semiconjapan.org Request More Information
Click Here to Read MoreDecember 13-15, 2016 San Francisco, CA Brewer Science will be presenting at the 13th Annual 3D Architectures for Semiconductor Integration and Packaging in San Francisco, California. Presentation: Temporary Wafer Bonding Technology for Advanced Packaging Session: Equipment and Materials 4:40PM - 5:00PM | Wednesday, December 14th, 2016 Dongshun Bai, Brewer Science Emerging Brewer Science Technologies at 3D…
Click Here to Read MoreDecember 07, 2016 – San Francisco, CA – Brewer Science is pleased to announce that Dr. Dongshun Bai, Senior Program Manager, will be speaking on new temporary wafer bonding technology at the 13th Annual 3D ASIP. This event, which will be held, December 13 through 15 in San Francisco, CA, is recognized as the principal…
Click Here to Read MoreNovember 30, 2016 – Tokyo, Japan – Make plans to visit with Brewer Science’s team of experts during SEMICON Japan 2016, which will be held December 14 through 16 at Tokyo Big Sight in Tokyo, Japan. This event has grown to become one of the largest international exhibitions and is known as the premier exposition…
Click Here to Read MoreNovember 16-17, 2016 Santa Clara, California Booth: T19 Presentation: Carbon Nanomaterials: Defining the Future of High-Speed Printed Sensors Time: November 16th, 2016 | 13:55 - 14:15 By: Nick Anthony and Rob Frueh This is the world’s largest event for printed and flexible electronics. This event, featuring more than 225 exhibitors from around the globe, is attended by…
Click Here to Read MoreNovember 08, 2016 – Santa Clara, CA – The technical team at Brewer Science will be showcasing new sensor technology featuring Brewer Science devices at Printed Electronics USA, which is a part of the IDTechEx Exhibit, November 16-17 in Santa Clara, CA. Printed Electronics USA 2016 has a reputation for showcasing tomorrow’s technology today and…
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