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October 9-12, 2017 Raleigh, NC Attend our joint paper with SUSS MicroTec Ablative Laser Patterning of Polymeric Dielectric Materials Author(s): Cristina Matos, Brewer Science, Inc. (Deborah Blumenshine, Lisa Kirchner, Rama Puligadda; Brewer Science, Inc.; Habib Hichri, Seongkuk Lee, Markus Arendt, Suss MicroTec Group) Wednesday, October 11, 2017, 8:30-8:55 am Abstract: Advances in the research and…
Click Here to Read MoreLearning more about our debonding technologies.
Click Here to Read MoreUltrafast, Highly Sensitive Printed Moisture Sensors for High-Speed Sensing Applications At the 2017 Sensors Expo & Conference that took place in San Jose, California last June, Dr. Vijaya Kayastha presented on an ultra-fast, highly sensitive printed moisture sensor developed at Brewer Science. Dr. Kayastha discussed the potential applications of these sensors that are not currently…
Click Here to Read MoreFrom its founding, Brewer Science has put a premium on creativity and innovation. These are the driving forces that have allowed it to obtain numerous patents and create products that affect millions of lives around the world. It’s also what allows Brewer Science to look beyond quarterly profits, create meaningful jobs and lead the microelectronics…
Click Here to Read MoreJune 13, 2017 – Rolla, MO – Brewer Science, a Missouri-based technology manufacturing company, is pleased to continue its tradition of supporting the arts by sponsoring a unique live concert featuring a performance by the internationally acclaimed Jacques Thibaud String Trio. Regarded as three of the world’s finest chamber musicians, the trio will travel from…
Click Here to Read MoreJuly 5, 2017 – Rolla, Missouri – For the fourth time, Brewer Science has been listed by the St. Louis Post-Dispatch as one of the top Midsize Workplaces. The company also was recognized as a Top Workplace in 2012, 2013 and 2015 by the St. Louis Post-Dispatch and received an honorable mention in 2016. Based on…
Click Here to Read MoreHow Temporary Bonding Works Learn how temporary bonding and ultra-thin wafers are being used to create smaller and faster electronic devices. Check out our temporary bonding materials here
Click Here to Read MoreThe Brewer Science family is sad to announce the passing of Dale Baney. As a 15 year employee of Brewer Science, Dale was a maintenance supervisor who led his teams to completing many key projects in his time at Brewer Science. Some of these projects include integral process improvements to our product manufacturing capabilities, upgrading…
Click Here to Read MoreDirected self-assembly (DSA) is an exciting new technology that uses specially designed block copolymers to form IC patterns on a molecular scale.
Click Here to Read MoreUnderstanding Panel-Level Processing Ram Trichur explains how the transition from conventional wafers to large panels can generate significant cost savings for fan-out wafer-level packaging, and how these large, thin panels pose new challenges for handling and processing. Learn more about our Wafer-Level Packaging developments here.
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