Compound Semiconductor Manufacturing 2016
See the next generation of temporary bonding equipment and thin wafer handling technology for SiC and compound semiconductor at the Brewer Science 2016 CS Mantech booth.
On display in the booth will be the new Cee® Apogee™ temporary bonding equipment suite designed with the DataStream™ Technology.
Ram Trichur and Matt Ziegler will be there to share the advancements in carrier technology for thinned wafer handling; and the new DataStream™ system that provides real-time process data and monitoring.
May 18th, 2016 · 11:40AM
SESSION 6a: PROCESS – III-V TECHNOLOGY
6a.5 “Temporary Bonding for Backside Processing of 150-mm SiC Wafers”
May 17th, 2016 · 5:00pm – 6:15pm
DataStreamTM Technology: The Next Generation of Tool Management
May 16th · 6:00 PM – 9:00 PM
May 17th · 9:00 AM – 5:20 PM
May 18th · 8:30 AM – 11:00 AM