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Whoever first coined the cliché “Don’t sweat the small stuff” didn’t work in nanotechnology. It’s a phrase that helps us put things into perspective. But if you’re in the compound semiconductor industry and measure things in micrometers, the small stuff is the only stuff worth sweating. There are two general obstacles that IC manufacturers struggle…
Click Here to Read MoreMay 7-10, 2018 Hyatt Regency Austin, Texas Description: The 2018 CS MANTECH Conference will be held in Austin, Texas, May 7-10 and is comprised of technical papers, talks, workshops, and manufacturer exhibits. The conference is open to anyone who is interested in the latest advances in compound semiconductor manufacturing and device technology. Make sure…
Click Here to Read MoreBrewer Science is headed to the CS ManTech conference May 18 through 21! CS ManTech is a respected organization focused on providing a forum for members of the compound semiconductor community to exchange and discuss new ideas. At this year's conference, we’re excited to share our findings regarding the ability of glass to be used…
Click Here to Read MoreCompound Semiconductor Manufacturing 2016 See the next generation of temporary bonding equipment and thin wafer handling technology for SiC and compound semiconductor at the Brewer Science 2016 CS Mantech booth. On display in the booth will be the new Cee® Apogee™ temporary bonding equipment suite designed with the DataStream™ Technology. Ram Trichur and Matt Ziegler…
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