April 12 - 15, 2021
Fountain Hills, Arizona
The 17th Annual Device Packaging Conference (DPC 2020) will be held in Fountain Hills, Arizona, from April 12-15, 2021. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS). The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, and sales & marketing professionals.
Brewer Science is a proud sponsor of this event, and several Brewer Science employees will be presenting their research at the event:
Baron Juang, Duo Tsai, Xiao Liu, Rama Puligadda presents, “A Novel Photosensitive Permanent Bonding Material for Polymer/Metal Hybrid Bonding”
Arthur Southard, Dongshun Bai, John Massey presents, “A Low Tg Bonding Material for use with Wafer-Level System-in-Package (WLSiP) and Fan-Out Wafer-Level Packaging (FOWLP) Processes”