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Since our inception, Brewer Science has been strongly committed to cultivating diversity. And we do so for one primary reason: a broad range of backgrounds leads to better ideas…
November 15, 2018 Blogs Read MoreThermal slide debonding represents the next significant advancement in obtaining high-yield thin wafer results. Initial detection of anomalies and cracks usually occurs during debonding; however, many causes for this damage…
Read MoreIn addition to precisely controlling application of the materials that enable wafer bonding, a solvent-enriched sealed spin chamber contributes to process integrity. One of the most critical variables in achieving…
Read MoreThe microelectronics industry is rapidly migrating to fabricating 3-D wafer stacking interconnects using through-silicon via (TSV) technology. Major market segments seeking to benefit from TSV technology include advanced packaging for…
Read MoreDeveloping photosensitive film layers to produce features of targeted sizes is a critical process step within any photolithography application. Application engineers have created several processes for performing this step with…
Read MoreIn recognition of its progress with temporary bonding and thin wafer handling, Brewer Science was featured in the November/December issue of Chip Scale Review. The feature discusses the company’s use…
Read MoreAnyone who has worked in a fancy restaurant can tell you that the small details make the biggest impact. The food has to be perfect, yes. But even a simple…
Read MoreThe Internet of Things (IoT) includes a number of different applications throughout a wide assortment of industries. In our first breakdown of applications within the IoT, we discussed how Brewer…
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