| Show Me | All News | Blog | Ebooks | Videos | Press Releases | Events |
|---|
Brewer Science will be exhibiting at booth #518 at SEMIEXPO Heartland. More information can be found in our press release. April 1–2, 2025 Indiana Convention Center 100 S. Capitol Ave. Indianapolis, IN 46225
Click Here to Read MoreHybrid Bonding Symposium hosted by IEEE Materials for Hybrid Bonding presented by Andrea Chacko Event: Hybrid Bonding Symposium hosted by IEEE Location: Silicon Valley, California Conference Center: SEMI World Headquarters 673 South Milpitas Blvd, Milpitas, CA USA Presentation: Materials for Hybrid Bonding Speaker: Andrea Chacko, PhD Date: January 16 – 17, 2025 Time:…
Click Here to Read MoreInnovation in hybrid bonding and laser debonding presented at EPTC in Singapore 3D Packaging and Thin Wafer Processing Research Co-Presented by Brewer Science Singapore – December 2, 2024 – Brewer Science, Inc., an industry leader in advanced packaging materials for semiconductor manufacturing, will present its latest research developing the next-generation of 3D packaging materials…
Click Here to Read MoreDougal Guerrero, Ph.D. will present "New materials towards sustainable manufacturing" at The Lithography Workshop 2024 in San Deigo, California on November 5th at 11:50AM PST.
Click Here to Read MoreMulti-Tier Die Stacking Enables Efficient Manufacturing Achieve higher integration density with collective die-to-wafer bonding Advanced packaging is currently facing a critical challenge to increase manufacturing efficiency without sacrificing device performance. Vertical integration techniques, such as multi-tier die stacking and hybrid bonding, enable increased integration density, therefore improving yield of high-quality devices. However, these…
Click Here to Read MoreBrewer Science Elevates Two Corporate Leaders to Chief Executive Role Corporate leadership developments to drive projected growth and innovation Rolla, MO – October 10, 2024 – Brewer Science, Inc., a global leader in developing and manufacturing innovative materials used to advance next-generation computing technologies, is elevating two senior leaders to co-chief executive. This change will…
Click Here to Read MoreBrewer Science presents Materials Innovation for Additive Electronics at InterPACK 2024 Building Circuits from the Ground Up: Domestic Advanced Packaging Relies on Additive Manufacturing San Jose, California – October 2, 2024 – Brewer Science, Inc., a global leader in advancing innovative materials needed for additive electronics, is presenting Building Circuits from the Ground Up:…
Click Here to Read MoreBrewer Science Elevates Veteran Leader and Welcomes New Market Strategy Officer to Propel Future Growth in Semiconductor Industry Corporate leadership developments to drive projected growth and innovation Rolla, MO – September 11, 2024 – Brewer Science, Inc., a global leader in developing and manufacturing innovative materials used to advance next-generation computing technologies, is elevating…
Click Here to Read MoreBrewer Science Presents Scalable, High-Purity Solutions for Semiconductor Manufacturing at AIChE Achieving High-Volume, Zero-Defect Quality Polymer Purification San Diego, CA – October 23, 2024 – Brewer Science, Inc., a high-volume manufacturer of ultrapure semiconductor materials, is presenting their latest innovation in polymer purification at the AIChE Conference from October 27th through 31st. Traditional Batch…
Click Here to Read MoreFive Questions to Ask When Selecting a Temporary Bonding and Debonding System Thin-wafer handling requires strategic material selection High-bandwidth memory blocks (HBM) memory, microprocessors, field-programmable gate arrays (FPGA), AI accelerators, and other devices used in advanced system-level packaging all rely on temporary bonding and debonding systems to shrink their footprint. Understanding which properties play…
Click Here to Read More