What is Fan-out Wafer-level Packaging?

What is “Fan-out Wafer-Level Packaging”?

Fan-out wafer-level packaging (FOWLP) has been described as a game changer by industry experts because of its thin form factor, low cost of ownership, and ease of integration using conventional wafer fab equipment. In this video, Ram Trichur describes a typical FOWLP process flow and the challenge of handling the thin reconstituted wafers.

Back to Newsroom