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Fabrication of microelectronic devices increasingly involves the creation of high-aspect-ratio structures (those with large height or depth and narrow width, such as trenches, vias, columns, and mesas). These structures provide isolation; serve as conduits for electrical, optical, or fluid signals; or enable pre-dicing before die singulation. New designs in semiconductor and MEMS devices are pushing…
Click Here to Read MoreProcess application engineers often encounter a variety of complex challenges related to deposition by spin coating, as many variables affect the quality of the spin-applied coating. These variables have critical effects on the overall coating uniformity, coating thickness, and subsequent device yield. Some of the more influential variables that must be controlled precisely are spin…
Click Here to Read MoreHigh-uniformity bake plates have been displacing convection ovens for well over two decades in the microelectronics industry. The disadvantages of variable temperature zones, lengthened cure times, and considerable particle contamination have been thoroughly analyzed and confirmed. Although temperature uniformity remains the primary advantage for precision hot plates, virtually eliminating skinning effects for thin-film (< 1-5…
Click Here to Read MoreOver the past decade, Brewer Science has developed and published various methods of creating a planar surface over three-dimensional (3-D) structures. Sharing these results invariably leads to a potential customer asking, “Can you fill the holes in my substrate that are x in size?” The short answer to the question is “Yes, we can.” Filling…
Click Here to Read MoreAt the Science Café event held at Farmers Gastropub on April 19, James E. (Jim) Lamb III, Brewer Science Corporate Technology Strategist and Director of the Printed Electronics Technology Center, spoke to the Springfield, MO, community about printed electronics and what we can expect to see in the future. His interesting and informative presentation described…
Click Here to Read MoreAs semiconductor devices evolve, smaller and smaller feature sizes are required to achieve the performance desired by the consumer. Smaller features give rise to lower power consumption for mobile devices, less expensive devices due to the ability to manufacture more chips per wafer, and faster overall speed. Why multilayer? Smaller feature sizes also lead to…
Click Here to Read MoreOne of the most critical variables in spin-coating processes is coating uniformity. In many cases, engineers are challenged with achieving ultralow total thickness variation at high film thicknesses while conserving expensive materials. To achieve such a highly uniform coating, automated control of the solvent vapors is essential. A closed bowl environment combined with a programmable…
Click Here to Read MoreWearable devices are all the rage right now, from FitBit products and the Apple Watch to the ever-evolving and highly anticipated Google Glass. But the idea and creation of wearable electronics occurred long before the cell phone or even the desktop computer. Brewer Science creates materials used in the sensors and MEMS devices that enable…
Click Here to Read MoreIn 1977, Intel introduced the 16-bit CPU at a small inaugural semiconductor event in Tokyo. While that 16-bit marvel is now a relic in the computing world, that little event in Tokyo has become one of the biggest semiconductor manufacturing and supply chain events in the world. And this year, SEMICON Japan is celebrating its…
Click Here to Read MoreRemember WWII’s Rosie the Riveter, the strong and capable figure symbolizing real-life women who took over factory work for men fighting overseas? Manufacturers are wishing Rosie would make a comeback — and this time they’d like her to vie for a leadership position as well. Though women now make up about 47 percent of the…
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