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SEMICON Japan 2016

December 14-16, 2016 Tokyo, Japan Booth: 3408 SEMICON Japan is the premier exposition for microelectronics manufacturing supply chain. Brewer Science products will be on display at our booth. Emerging Brewer Science Technologies at SEMICON Japan Wafer-Level Packaging Directed-Self Assembly Multilayer Systems Conference Website: http://www.semiconjapan.org Request More Information

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3D ASIP

December 13-15, 2016 San Francisco, CA Brewer Science will be presenting at the 13th Annual 3D Architectures for Semiconductor Integration and Packaging in San Francisco, California. Presentation: Temporary Wafer Bonding Technology for Advanced Packaging Session: Equipment and Materials 4:40PM - 5:00PM | Wednesday, December 14th, 2016 Dongshun Bai, Brewer Science Emerging Brewer Science Technologies at 3D…

  2016, Wafer-Level packaging Click Here to Read More

Printed Electronics USA

November 16-17, 2016 Santa Clara, California     Booth: T19 Presentation: Carbon Nanomaterials: Defining the Future of High-Speed Printed Sensors Time: November 16th, 2016 | 13:55 - 14:15 By:  Nick Anthony and Rob Frueh This is the world’s largest event for printed and flexible electronics. This event, featuring more than 225 exhibitors from around the globe, is attended by…

  2016, Printed Electronics, Printed Electronics USA Click Here to Read More

IEEE Sensors

October 30- November 2nd, 2016 Orlando, Florida http://ieee-sensors2016.org/     Come check out our InflectTM sensors demos at booth 12

  Sensors, ieee, inflect, 2016 Click Here to Read More

EUV Lithography Symposium

October 24-26, 2016 Hiroshima, Japan http://euvl2016.org/ Please look for Tanti Ouattara's poster at 2016 International EUVL Symposium.

  2016, EUV Click Here to Read More

DSA Symposium 2016

October 11-13, 2016 Leti Grenoble, France http://www.dsasymposium.org/index.php/homepage/venue This symposium on directed self-assembly (DSA) will be held in Grenoble, France and will include presentations and exhibits featuring materials, processing, DSA-friendly design, etch, simulations, 2D and 3D metrology, pattern placement, integration, and DSA extendibility. This event is designed to be a mix of industrial and academic contributors…

  2016 Click Here to Read More

University of Illinois

October 6th, 2016 Champaign, Illinois

  2016, Career Fairs Click Here to Read More

University of North Texas

September 29th, 2016 Denton, Texas

  2016, Career Fairs Click Here to Read More

University of Arkansas

September 28th, 2016 Fayetteville, Arkansas

  2016, Career Fairs Click Here to Read More

University of Missouri - Science and Technology

September 27th, 2016 Rolla, Missouri

  2016, Career Fairs Click Here to Read More
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