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Presentation Friday, June 3rd · 2:20PM Session 36: 3D materials & Processing Extremely Low-Force Debonding of Thinned CMOS Substrate by Laser Release of a Temporary Bonding Material" Alain Phommahaxay, Goedele Potoms, Greet Verbinnen, Erik Sleeckx, Gerald Beyer, and Eric Beyne – IMEC; Alice Guerrero, Dongshun Bai, Xiao Liu, Kim Yess, and Kim Arnold – Brewer…
Click Here to Read MoreCompound Semiconductor Manufacturing 2016 See the next generation of temporary bonding equipment and thin wafer handling technology for SiC and compound semiconductor at the Brewer Science 2016 CS Mantech booth. On display in the booth will be the new Cee® Apogee™ temporary bonding equipment suite designed with the DataStream™ Technology. Ram Trichur and Matt Ziegler…
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