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March 7-8, 2017 Brussels, Belgium Ulrich Herleb "A Novel Approach To How The World Senses: Highly Sensitive, Real-time Response, Light-weight And Flexible Sensor Systems Tuesday, March 7, 2017 14:50…
March 7-8, 2017 Event Read MoreIn previous posts, we’ve made references to Moore’s law and how, with uncanny accuracy, it has predicted that the number of transistors in a dense integrated circuit (IC) would double…
Read MoreFebruary 13, 2017 – Tokyo, Japan – Brewer Science invites you to join them February 15 through February 17 at Printable Electronics Japan 2017, a part of the Converting Technology…
Read MoreFebruary 10, 2017 – San Jose, CA – Brewer Science invites you to join us February 26 through March 2 at SPIE Advanced Lithography in San Jose, CA, as we…
Read MoreMultilayer technology from Brewer Science has allowed the industry to continue to push the limits of advanced lithography well into the future. Our experts explain why it was needed and…
Read MoreProTEK® Materials Highly oleophobic and hydrophobic transparent scratch-resistant coating.
Read MoreWhy do we need temporary bonding technology? Ram Trichur is back to discuss how temporary wafer bonding technology allows IC manufacturers to safely handle ultra-thin wafers during advanced processing and…
Read MoreWhat is "Fan-out Wafer-Level Packaging"? Fan-out wafer-level packaging (FOWLP) has been described as a game changer by industry experts because of its thin form factor, low cost of ownership, and…
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