Fan-Out Wafer-Level Packaging

What is "Fan-out Wafer-Level Packaging"? Fan-out wafer-level packaging (FOWLP) has been described as a game changer by industry experts because of its thin form factor, low cost of ownership, and ease of integration using conventional wafer fab equipment. In this video, Ram Trichur describes a typical FOWLP process flow and the challenge of handling the…

[VIDEO] Brewer Science InFlect™ Sensors

Video Brewer Science InFlect™ Sensors In an industry where milliseconds count, contact a Brewer Science expert to start monitoring and understanding your process better.

High-Speed Temperature Sensing in Roll-to-Roll Processing

High-Speed Temperature Sensing in Roll-to-Roll Processing Brewer Science printed thermistors are among the fastest on the market, are highly accurate, and can operate at extremely low power, due to a revolutionary carbon nanotechnology design. InFlectTM thermistors utilize our revolutionary carbon-based nanotechnology to deliver highly accurate and real-time response to small changes in temperature.