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High-energy pulse clearing of environmentally sensitive CNT thin-film devices

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Adhesion layers for EUV lithography

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Bottom-up conformal coating and photopatterning on PAG-immobilized surfaces

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LASER-RELEASABLE BONDING MATERIALS FOR 3-D IC APPLICATIONS 

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 Poly(cyanocinnamate)s for structural and optical applications

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Permanent bonding and patterning material

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Underlayers for EUV Lithography

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Selective liquidphobic surface modifications

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High-silicon-content wet-removable planarizing layer

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Printable dispersion with tunable viscosity

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