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BrewerBOND® T1100/C1300 series materials enable our unique VersaLayerTM system for high-temperature and high-stress applications found within the semiconductor industry. BrewerBOND® T1100/C1300 Series Material Benefits VersaLayerTM system with high-Tg thermoplastic and curable material Mechanical stability, no movement of bonding material, and thermal stability ≤ 400°C Low-temperature bonding (≤ 25°C) Increased throughput Increased adhesion at all interfaces…
Click Here to Read MoreNext Generation Packaging Solutions Brewer Science is revolutionizing packaging with innovative thin wafer handling (TWH) technologies. Our diverse set of high-performance materials allow for higher throughput, reduction in form factor, and lower cost. We work with leading equipment vendors to provide fully automated solutions for high-volume needs. Talk to an Expert Today
Click Here to Read MoreThe BrewerBOND® 530 mechanical debonding release material offers the additional adhesion necessary for high-stress temporary bonding applications. Mechanical Release Layer Compatibility BrewerBOND® 530 material is most compatible with the following Brewer Science bonding materials: WaferBOND® HT-10.11 material BrewerBOND® 305 material BrewerBOND® 530 material is a mechanical debonding release material that has been specifically designed for…
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