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BrewerBUILD™ Material Series

BrewerBUILD™ Material Series The introduction of the BrewerBUILD™ material series offers an industry-wide multifunctional solution addressing the challenges associated with redistribution layer (RDL)-first/chip-last packaging in wafer- or panel-level processes. Talk to an Expert Today

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BrewerBOND® T1100/C1300 Series Materials

BrewerBOND® T1100/C1300 series materials enable our unique Dual-Layer solution for high-temperature and high-stress applications found within the semiconductor industry. BrewerBOND® T1100/C1300 Series Material Benefits Dual-Layer system with high-Tg thermoplastic and curable material Mechanical stability, no movement of bonding material, and thermal stability ≤ 400°C Low-temperature bonding (≤ 25°C) Increased throughput Increased adhesion at all interfaces…

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Wafer-Level Packaging

Next Generation Advanced Packaging Technology Brewer Science is revolutionizing wafer-level packaging with innovative thin wafer handling (TWH) technologies. Our diverse set of high-performance materials allow for higher throughput, reduction in form factor, and lower cost. We work with leading equipment vendors to provide fully automated solutions for high-volume needs. Talk to an Expert Today

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BrewerBOND® 530 Material

The BrewerBOND® 530 mechanical debonding release material offers the additional adhesion necessary for high-stress temporary bonding applications. Mechanical Release Layer Compatibility BrewerBOND® 530 material is most compatible with the following Brewer Science bonding materials: WaferBOND® HT-10.11 material BrewerBOND® 305 material BrewerBOND® 530 material is a mechanical debonding release material that has been specifically designed for…

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