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Embedded Wafer-Level Ball Grid Array

The terms "quantity" and "quality" are often discussed in "either/or" scenarios. On one side, you get a lot of something. On the other side, you get the best of something else. In these scenarios, you can't have both, at least not at the same time. In the semiconductor industry, there is constant innovation and limit…

  Wafer-Level packaging, 3D Stacking, eWLB, embedded wafer-level, debonding, grid array Click Here to Read More

Heat and Lateral Force: A Perfectly Complex Debonding Process

As part of its efforts to make devices faster and more efficient, Brewer Science is on the cutting edge of the technology that allows more transistors to fit into the same integrated circuit footprint as in the past. A 3-D stacking process uses a new bonding material and 300-mm wafer bonders to effectively solve the…

  Wafer-Level packaging, 3D Stacking, BrewerBOND 220, Heat, Debonding Process, Lateral Force Click Here to Read More