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The Road to 3D Integration

“Just the tip of the iceberg.” What a great saying. It means what we can see pales in comparison to what we can’t. In the world of technology, people often marvel at the end product but rarely consider the extremely important advances and transitional processes that make it all possible. As smaller chip sizes and…

  2.5d, Wafer-Level packaging, integration, 2d, 3d Click Here to Read More

Wafer-Level Packaging and the Mobile Revolution

Back in September and this past March, Apple held its biannual Special Events. These events are meant to introduce new products and features, and they happen quite regularly. These two recent events, however, seemed to leave something out: computers. September’s presentation was over two hours long and didn’t once mention the flagship devices that put…

  FOWLP, Integrated Circuits, 2d, 3d, Wafer-Level packaging Click Here to Read More
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