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Brewer Science technology, forecasts highlighted in Chip Scale Review

In recognition of its progress with temporary bonding and thin wafer handling, Brewer Science was featured in the November/December issue of Chip Scale Review. The feature discusses the company’s use of wafer-level packaging (WLP) technologies in semiconductor segments, including fan-out WLP (FOWLP); fan-in wafer-level chip-scale package (FI-WLCSP); 3-D FOWLP; 2.5-D integration with interposer technology; and…

  Wafer-Level packaging, Advanced Packaging, FOWLP, debonding materials Click Here to Read More

2018 Outlook for Advanced Packaging Materials

Advanced packaging is moving mainstream as manufacturers continue to seek ways to improve device performance beyond traditional scaling. The semiconductor industry is also witnessing increasing investments in packaging, in terms of capabilities, capacity, and infrastructure from the assembly and packaging houses. All this attention on packaging is primarily driven by the need to deliver highly…

  Advanced Packaging, brewer science Click Here to Read More

Advanced Packaging & System Integration Technology Symposium

June 20, 2018 – June 21, 2018 Wuxi, China     Description: Join experts from around the world to discuss industry topics and key applications surrounding the packaging industry. You won’t want to miss this chance to connect with leaders to talk about emerging applications challenges and the future of the industry. Make sure to…

  Events, 2018, Advanced Packaging Click Here to Read More