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Overcoming spin-coating challenges for square substrates

Process application engineers often encounter a variety of complex challenges related to deposition by spin coating, as many variables affect the quality of the spin-applied coating. These variables have critical effects on the overall coating uniformity, coating thickness, and subsequent device yield. Some of the more influential variables that must be controlled precisely are spin…

  Wafer-Level packaging, coat uniformity, spin coat, spin process, square substrate Click Here to Read More

Controlling the spin bowl environment to optimize spin coat quality

A variety of factors can affect the coat quality when spin processing. This article will focus on the role that the bowl environment, and in particlar the ability to control the fume exhaust, has on this process. The drying rate of the resin fluid during the spin process is defined by the nature of the…

  other, spincoat, coat uniformity, spin coat, spin process, spin bowl Click Here to Read More

Bake plate enhancements for optimal thick-film curing results

High-uniformity bake plates have been displacing convection ovens for well over two decades in the microelectronics industry. The disadvantages of variable temperature zones, lengthened cure times, and considerable particle contamination have been thoroughly analyzed and confirmed. Although temperature uniformity remains the primary advantage for precision hot plates, virtually eliminating skinning effects for thin-film (< 1-5…

  other, coat uniformity, thick-film Click Here to Read More

Solvent vapor control for optimal thick-film spin coating

One of the most critical variables in spin-coating processes is coating uniformity. In many cases, engineers are challenged with achieving ultralow total thickness variation at high film thicknesses while conserving expensive materials. To achieve such a highly uniform coating, automated control of the solvent vapors is essential. A closed bowl environment combined with a programmable…

  thick-film, spin coat, Wafer-Level packaging, coat uniformity Click Here to Read More
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