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Protecting key device features during wet-etch processing

With the explosion in demand for devices that include features in the tens to hundreds of microns, wet-etching is seeing new relevance. Light-emitting diodes (LED), microfluidic devices, ink-jet printer heads, sensors, and many other devices are being mass produced in semiconductor-fab-like environments. However, these feature sizes often do not demand the precision, of plasma etching,…

  LED manufacturing, DRIE, GaN roughening, etch protection, wet etching Click Here to Read More