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Sacrificial Laser Release Materials for RDL-First Fan-out Packaging

 Article published in Chip Scale review's March - April 2018; Volume 22, Number 2 Issue The semiconductor industry is in a new age where device scaling will not continue to provide the cost reductions or performance improvements at a similar rate to past years when Moore’s law was the guiding principle for IC scaling. The…

  laser debonding, RDL-first, thermal slide debonding, Fan-Out Wafer Level Packaging, chemical stability Click Here to Read More