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Heat and Lateral Force: A Perfectly Complex Debonding Process

As part of its efforts to make devices faster and more efficient, Brewer Science is on the cutting edge of the technology that allows more transistors to fit into the same integrated circuit footprint as in the past. A 3-D stacking process uses a new bonding material and 300-mm wafer bonders to effectively solve the…

  Lateral Force, Wafer-Level packaging, 3D Stacking, BrewerBOND 220, Heat, Debonding Process Click Here to Read More