Brewer Science


Show Me All News Blog Ebooks Videos Press Releases Events

Related Articles

Photonic debonding provides a more cost-efficient, higher-throughput debond process

A high-level overview of wafer-level debonding options and considerations   As emerging technologies require ultrathinned device wafers, traditional debonding processes can pose some challenges. Photonic debonding is an innovative debonding process utilizing a carrier coated with an inorganic metal release layer that aids in the release of the thinned wafer from the carrier substrate with…

  Photonic Debonding, Temporary Bonding Click Here to Read More