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Overcoming spin-coating challenges for square substrates

Process application engineers often encounter a variety of complex challenges related to deposition by spin coating, as many variables affect the quality of the spin-applied coating. These variables have critical effects on the overall coating uniformity, coating thickness, and subsequent device yield. Some of the more influential variables that must be controlled precisely are spin…

  Wafer-Level packaging, coat uniformity, spin coat, spin process, square substrate Click Here to Read More

Controlling the spin bowl environment to optimize spin coat quality

A variety of factors can affect the coat quality when spin processing. This article will focus on the role that the bowl environment, and in particlar the ability to control the fume exhaust, has on this process. The drying rate of the resin fluid during the spin process is defined by the nature of the…

  coat uniformity, spin coat, spin process, spin bowl, other, spincoat Click Here to Read More