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Overcoming spin-coating challenges for square substrates

Process application engineers often encounter a variety of complex challenges related to deposition by spin coating, as many variables affect the quality of the spin-applied coating. These variables have critical effects on the overall coating uniformity, coating thickness, and subsequent device yield. Some of the more influential variables that must be controlled precisely are spin…

  spin coat, spin process, square substrate, Wafer-Level packaging, coat uniformity Click Here to Read More