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Photonic debonding provides a more cost-efficient, higher-throughput debond process

A high-level overview of wafer-level debonding options and considerations   As emerging technologies require ultrathinned device wafers, traditional debonding processes can pose some challenges. Photonic debonding is an innovative debonding process utilizing a carrier coated with an inorganic metal release layer that aids in the release of the thinned wafer from the carrier substrate with…

  Photonic Debonding, Temporary Bonding Click Here to Read More

Brewer Science Unveils BrewerBOND® Dual-Layer Temporary Bonding System and BrewerBUILD™ Material for RDL-First Fan-Out Packaging

Rolla, Missouri – Sept. 3, 2018 – Brewer Science, Inc. today, from SEMICON Taiwan 2018, introduced the latest additions to its industry-leading BrewerBOND® family of temporary bonding materials, as well as the first product in its new BrewerBUILD™ line of thin spin-on packaging materials. BrewerBUILD delivers an industry-first solution to address manufacturers’ evolving wafer-level packaging…

  Temporary Bonding, BrewerBUILD, Material, BrewerBOND Click Here to Read More

Temporary Bonding and the Importance of Thermal Stability

Noted author and futurist Ray Kurzweil wrote back in 2001, "We won’t experience 100 years of progress in the 21st century — it will be more like 20,000 years of progress. . . ." From the invention of the first integrated circuit in 1958, technology has evolved at an unbelievable rate, and, as Kurzweil suggests, that won't…

  Wafer-Level packaging, Temporary Bonding, Ray Kurzweil, Thermal Stability Click Here to Read More

How Temporary Bonding Works

How Temporary Bonding Works Learn how temporary bonding and ultra-thin wafers are being used to create smaller and faster electronic devices. Check out our temporary bonding materials here

  Temporary Bonding Click Here to Read More

Why do we need temporary bonding technology?

Why do we need temporary bonding technology? Ram Trichur is back to discuss how temporary wafer bonding technology allows IC manufacturers to safely handle ultra-thin wafers during advanced processing and packaging steps. Thinning the wafers before the chips are packaged allows for thinner electronic devices and overall better performance Check out our temporary bonding materials…

  2017, Temporary Bonding, Technology Click Here to Read More
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