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Process methodologies for temporary thin wafer handling solutions

Use of temporary bonding/debonding as part of thin wafer handling processes is rapidly increasing. Users must determine which temporary bonding/debonding method is appropriate for a specific application. Some of the technologies that have been developed are chemical release, thermal slide separation, and ZoneBOND® debonding. The chemical release process requires very little force to release the…

  Wafer-Level packaging, thermal slide debonding, temporary bonding materials, thin wafer handling, ZoneBOND Click Here to Read More

Sacrificial Laser Release Materials for RDL-First Fan-out Packaging

 Article published in Chip Scale review's March - April 2018; Volume 22, Number 2 Issue The semiconductor industry is in a new age where device scaling will not continue to provide the cost reductions or performance improvements at a similar rate to past years when Moore’s law was the guiding principle for IC scaling. The…

  Fan-Out Wafer Level Packaging, chemical stability, laser debonding, RDL-first, thermal slide debonding Click Here to Read More