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Temporary Bonding and the Importance of Thermal Stability

Noted author and futurist Ray Kurzweil wrote back in 2001, "We won’t experience 100 years of progress in the 21st century — it will be more like 20,000 years of progress. . . ." From the invention of the first integrated circuit in 1958, technology has evolved at an unbelievable rate, and, as Kurzweil suggests, that won't…

  Wafer-Level packaging, Temporary Bonding, Ray Kurzweil, Thermal Stability Click Here to Read More