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Through-silicon vias (TSVs) are becoming increasingly common for high-speed and high-bandwidth connections on a chip. TSVs are especially important in 3D packaging schemes and are also used in many sensor, MEMS, and LED devices. While it is common to use deep reactive ion etching (DRIE) for creating the TSVs, wet etching of the silicon to…
Click Here to Read MoreWith the explosion in demand for devices that include features in the tens to hundreds of microns, wet-etching is seeing new relevance. Light-emitting diodes (LED), microfluidic devices, ink-jet printer heads, sensors, and many other devices are being mass produced in semiconductor-fab-like environments. However, these feature sizes often do not demand the precision, of plasma etching,…
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