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Process methodologies for temporary thin wafer handling solutions

Use of temporary bonding/debonding as part of thin wafer handling processes is rapidly increasing. Users must determine which temporary bonding/debonding method is appropriate for a specific application. Some of the technologies that have been developed are chemical release, thermal slide separation, and ZoneBOND® debonding. The chemical release process requires very little force to release the…

  Wafer-Level packaging, thermal slide debonding, temporary bonding materials, thin wafer handling, ZoneBOND Click Here to Read More