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The choice to be environmentally responsible began when the company was founded in 1981. The owner of Brewer Science, Dr. Terry Brewer, was focused on creating value for our customers through original technology products in the semiconductor market. As Brewer Science invented new products and technologies and manufactured them, Dr. Brewer continued to instill confidence…
Click Here to Read MoreThe growing use of actionable information in new ways to make better decisions is driving brisk growth in printed electronics (PE) and sensors. According to BCC Research, the global market for sensors should grow from $173.4 billion in 2019 to reach $323.3 billion by 2024 – a compound annual growth rate (CAGR) of 13.3%. Where…
Click Here to Read MoreUncover endless possibilities with Brewer Science, a leading innovator in technology. Each year, we offer a variety of internships, co-ops and post-doc opportunities to those seeking a career in technology. Opportunities range from traditional science, technology, engineering and math (STEM) programs to business development and purchasing, to name a few. “Brewer Science is not only…
Click Here to Read MoreSince our inception, Brewer Science has been strongly committed to cultivating diversity. And we do so for one primary reason: a broad range of backgrounds leads to better ideas and more innovation. But diversity in and of itself isn’t enough; we seek out truly unique talent that will bring the right mix of education,…
Click Here to Read MoreAs part of the manufacturing and innovation industry, Brewer Science relies on the growth of STEM education, jobs, and overall interest in the subjects to maintain our business model in the U.S. Our president and founder, Dr. Terry Brewer, addresses three main initiatives to help ensure the growth of STEM: Expand STEM opportunities in the…
Click Here to Read MoreThermal slide debonding represents the next significant advancement in obtaining high-yield thin wafer results. Initial detection of anomalies and cracks usually occurs during debonding; however, many causes for this damage originate during upstream bonding material coating, curing, bonding, and thinning processes. Moreover, only thermal separation tools that are highly precise and highly accurate will consistently…
Click Here to Read MoreIn addition to precisely controlling application of the materials that enable wafer bonding, a solvent-enriched sealed spin chamber contributes to process integrity. One of the most critical variables in achieving optimal uniformities at the desired target thickness is airflow dynamics. Ideal conditions are created in a sealed chamber with a prewet solvent nozzle, a backside…
Click Here to Read MoreDeveloping photosensitive film layers to produce features of targeted sizes is a critical process step within any photolithography application. Application engineers have created several processes for performing this step with tank immersion (that is, a bath) and/or several adaptations of spin developing a single wafer to make patterns of features based on film areas of…
Click Here to Read MoreThe microelectronics industry is rapidly migrating to fabricating 3-D wafer stacking interconnects using through-silicon via (TSV) technology. Major market segments seeking to benefit from TSV technology include advanced packaging for memory/logic, light-emitting diodes (LEDs), and compound semiconductor (III-V) high-power radio-frequency (RF) devices. In this cutting-edge technology, fragile device substrates are bonded to carrier substrates with…
Click Here to Read MoreThe Internet of Things (IoT) has made substantial strides since first being envisioned in 1999, having moved beyond machine-to-machine communications, toward impacting a variety of industries with “smart” devices. Nearly 26 billion devices will be connected to the IoT by 2020, according to technology research firm Gartner, Inc., and the majority of these devices fit…
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