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Five Questions to Ask When Selecting a Temporary Bonding and Debonding System Thin-wafer handling requires strategic material selection High-bandwidth memory blocks (HBM) memory, microprocessors, field-programmable gate arrays (FPGA), AI accelerators, and other devices used in advanced system-level packaging all rely on temporary bonding and debonding systems to shrink their footprint. Understanding which properties play…
Click Here to Read MoreCollaboration and Persistence: Two Critical Components of Technology Innovation How Brewer Science's R&D Shapes the Future of Technology by Challenging Today’s Assumptions In the dynamic realm of technology, pioneers often face skepticism before their innovations are embraced. Imagine the 1980s, a time when the semiconductor industry teetered on the brink of transformation. Amidst uncertainty,…
Click Here to Read MoreMastering Semiconductor Technology: Exploring the Fundamentals of Photolithography Essential Insights into Patterning, Photoresist, and Antireflective Coatings In the semiconductor materials industry, photolithography is a crucial technology for creating intricate electronic circuits. Essentially, it's the art of printing at the nanoscale level, enabling the precise patterning of semiconductor materials. The ability to do this well…
Click Here to Read MoreBrewer Science is featured in The Wall Street Journal article, "American Manufacturers Seek Perfection as Quality Issues Mount" published on March 18, 2024. You can view the full article here. (subscription required) The Wall Street Journal business reporter, John Keilman, starts the article with an intriguing thought: "Imagine a world in which every product that…
Click Here to Read MoreA high-level overview of wafer-level debonding options and considerations As emerging technologies require ultrathinned device wafers, traditional debonding processes can pose some challenges. Photonic debonding is an innovative debonding process utilizing a carrier coated with an inorganic metal release layer that aids in the release of the thinned wafer from the carrier substrate with…
Click Here to Read MoreSpecial thanks to Phelps County Focus for featuring this article on November 16, 2023 By Hannah Martinez, Staff Writer at Phelps County Focus hannah@phelpscountyfocus.com Einstein’s General Theory of Relativity states that everything is relative—time and even distance depend on the perspective of the observer. Artists create lifelike perspective, which is the 3-D portrayal of depth and…
Click Here to Read MoreMethods on how to detect and reduce defects in the fab and supply chain Semiconductors may be small, but the impacts they have are significant. Semiconductors used in life-dependent applications, such as pacemakers, defibrillators, life support systems, automotive safety systems, or in aviation need to be fail-proof. A device smaller than a centimeter with…
Click Here to Read MoreJoin Tom Brown, Executive Director, Semiconductor Business Unit at Brewer Science, as he shares inspirational leadership advice and professional growth stories. At Brewer Science, we have developed a Competency Framework to aid in the growth of our employees in their work, but more importantly in their life. We’ve identified four main competency areas: Leadership…
Click Here to Read MoreThree Steps to Defect Reduction in Semiconductor Materials How to Identify Impurities Through Polymer Analysis Brewer Science conducts polymer analysis and characterization as a fundamental step in quality assurance and control (QA/QC). With over 40 years of experience in the semiconductor market, and surpassing quality expectations of ISO 1900:2015, Brewer Science offers polymer analysis and…
Click Here to Read MoreNine Essential Criteria to Achieve a Successful Bonding Process A photosensitive permanent bonding material enables the creation of high-quality permanent bonds between dissimilar materials used in the creation of MEMS and sensors. Having a thorough understanding of the materials and product performance is crucial to the success of the end application. In this article, we…
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