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December 07, 2016 – San Francisco, CA – Brewer Science is pleased to announce that Dr. Dongshun Bai, Senior Program Manager, will be speaking on new temporary wafer bonding technology at the 13th Annual 3D ASIP. This event, which will be held, December 13 through 15 in San Francisco, CA, is recognized as the principal…
Click Here to Read MoreNovember 30, 2016 – Tokyo, Japan – Make plans to visit with Brewer Science’s team of experts during SEMICON Japan 2016, which will be held December 14 through 16 at Tokyo Big Sight in Tokyo, Japan. This event has grown to become one of the largest international exhibitions and is known as the premier exposition…
Click Here to Read MoreNovember 08, 2016 – Santa Clara, CA – The technical team at Brewer Science will be showcasing new sensor technology featuring Brewer Science devices at Printed Electronics USA, which is a part of the IDTechEx Exhibit, November 16-17 in Santa Clara, CA. Printed Electronics USA 2016 has a reputation for showcasing tomorrow’s technology today and…
Click Here to Read MoreOctober 28, 2016 – Orlando, FL – Brewer Science, a technology pioneer, will be showcasing new sensor technology at IEEE SENSORS 2016, October 30 through November 2 in Orlando, Florida. IEEE SENSORS 2016 will attract approximately 800 sensor and sensor system practitioners with an interest in gaining greater understanding and moving the industry forward. The…
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